• Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
  • Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
  • Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
  • Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
  • Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
  • Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB

Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB

Material: Organic Silicone
Application: Industrial
Certification: ISO, FDA, REACH, RoHS
Samples:
US$ 30/kg 1 kg(Min.Order)
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Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB pictures & photos
Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
US $3.46-5.28 / kg
Min. Order: 200 kg
Gold Member Since 2023

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Guangdong, China

Basic Info.

Model NO.
INI-90 Series
Use
Potting
Appearance
Liquid
Hardness
35 Shore a
Mix Ratio
1:1
Viscosity
2500 Cps
Fire Resistance
UL94-V0
Mode
Ini-9035
Operate Time
30-50 Minutes
Curing Time
3-5 Hours
Thermal Conductivity
0.8
Dielectric Strength
25
Certificates
FDA, MSDS, Reach, RoHS, ISO
Lead Time
3-5 Days After Payment Receiving.
Package
25kg/200kg
Shelf Life
12 Months
Transport Package
25kg/200kg
Trademark
INIBABA
Origin
Shenzhen, China
HS Code
39100000
Production Capacity
800 Tons Per Year

Packaging & Delivery

Package Size
90.00cm * 90.00cm * 90.00cm
Package Gross Weight
20.000kg
Lead Time
3 days (1 - 200 kg)
5 days (201 - 500 kg)
7 days (501 - 1000 kg)
To be negotiated ( > 1000 kg)

Product Description


 

Silicone Potting Compound
INI-9035

 



Description  
Two-component silicone, platinum-curing, flowable, vulcanizes at room temperature. 
Can be used for a long time in the temperature range of - 65 ° C - 200 ° C and keep its soft and elastic properties. 

Application
Used for potting, encapsulating, sealing and bonding, widely used in electronic products, electricity, power supply, automotive ect. For example, used for potting of electronic components, power module and control module and controllers, junction box, solar cell assembly etc..
Can reduce stress and withstand high and low temperature impact. For the high power control module, thermal conductive silicone is used to achieve the function of heat dissipation, or outdoor protection for electronics such as LED screen.
Improve the insulation level of electronics, improve heat dissipation, and avoid the risk of electronics overheating and burning in a short time.
 
Features & Advantages

  • Excellent flow leveling
  • Fire proof, flame retardant
  • Waterproof
  • Insulation
  • Moisture proof
  • Anti-fouling
  • Anti-corrosion
  • Quake-proof/ withstand vibration
  • Thermal conductive
  • Ozone resistance
  • Weather aging resistance
  • Low shrinkage
  • Can be operated in all kinds of harsh environments without too much requirement for the environment (Moisture, salt fog, dust, vibration, heat, deep sea, cold, etc.).

Typical properties INI-9035
Properties Index Test Report
Before Curing Appearance Black, white, red Fluid
Viscosity(cps) 2500±500
(Adjustable)
Operating Mixing Ratio(By weight) 1 :1
Operating Time(25ºC  /min) 20~30  
(Adjustable)
Curing time (hr, basically cured) 1~2  
(Adjustable)
Curing time (hr, perfectly cured) 12
After Curing Hardness (shore A) 35±5
Thermal conductivity [W(m·K)] ≥0.8
Dielectric strength(kV/mm) ≥25
Dielectric constant(1.2MHz) 3.0~3.3
Volume resistivity(Ω·cm) ≥1.0×1016
Fire resistance UL94-V0
Density (g/cm) 1.35
Notes: Above data are only reference values, actual data is floating and adjustable.
 



Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
 

Operation instructions

  1. Mix part A and pars B evenly with 100:3 mixing ratio.

Notes: 1) Weigh the two parts exactly by electronic weight. For example, the operation time will be shorten after adding too much catalyst.

 

           2)Mix part A and part B evenly. Otherwise the silicon rubber will be partly solidified which will make the finished molds meet a short life and waste silicon rubber.

 

         

       2.Vacuum pumping

 

Notes: 1) This step is not have to have, but it is best if there is one. It will discharge all air in the mixture successfully, so as to ensure that there

will be no bubbles in the finished mold.

 

          2) This step is less than 10 minutes. Otherwise, it Will cause cross-linking reaction, and no more further steps will be available.

 

 

     3.Pouring casting or Brush molding

 

Notes:1) For simple pattern products we suggest use pouring operation way, which will be very easy to operate and demould. Pourable silicone require low viscosity which will be easy to flow smoothly and easy to de-air.

 

           2)For delicate pattern products we suggest use brushing operation way, which can copy the pattern exactly. Brushable silicone require high viscosity which won't be easy to flow away and easy to brush.      

 

           3)We suggest to set the mold for another 12 hours after demould before put it into large production.

Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB


Package details:1kg/5kg/20kg/25kg/200kg
Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB

 

 

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From payment to delivery, we protect your trading.
Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB pictures & photos
Insulation Waterproofing Low Viscosity Liquid Electronic Compound Silicone for PCB
US $3.46-5.28 / kg
Min. Order: 200 kg
Gold Member Since 2023

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory
Management System Certification
ISO 9001
Export Year
2006-06-06